This picture showsMahdi Soltani

Dr.-Ing.

Mahdi Soltani

Research Associate
Institute for Micro Integration

Contact

+49 711 685-84737

Allmandring 9 b
70569 Stuttgart
Deutschland

M. Soltani, R. Kulkarni, T. Groezinger and A. Zimmermann, “A Novel Approach for Lifetime Estimation of Electronic Components mounted on Plastic Substrates by Coupling Injection Molding Simulation to FE-Analysis” International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES), Wilmington, USA, 2019.

M. Soltani, R. Kulkarni, T. Scheinost, T. Groezinger and A. Zimmermann, “A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation” The Multidisciplinary Open Access Journal IEEE Access, DOI: 10.1109/ACCESS.2019.2913786, Bd. 7, S. 56163–56173, 2019.

M. Soltani: Zuverlässigkeitsuntersuchungen und Lebensdauermodelle von LEDs auf räumlichen Schaltungsträgern, Workshop "Visions to Products – MID and Beyond", Stuttgart, 2019.

M. Soltani: Untersuchungen zu Zuverlässigkeit und Entwärmung von LEDs auf räumlichen Schaltungsträgern, Kolloquium der Mikrosystemtechnik, Stuttgart, 2019.

M. Soltani, M. Freyburger, R. Kulkarni, R. Mohr, T. Groezinger and A. Zimmermann, “Reliability study and thermal performance of LEDs on molded interconnect devices (MID) and PCB,” The Multidisciplinary Open Access Journal IEEE Access, DOI: 10.1109/ACCESS.2018.2869017, Bd. 6, S. 51669–51679, 2018.

M. Soltani, M. Freyburger, R. Kulkarni, R. Mohr, T. Groezinger and A. Zimmermann, „Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices“, Journal MDPI: Instruments, DOI: 10.3390/instruments2040028, Bd. 2, Nr. 4, S. 28, Dez. 2018.

M. Soltani, F. Zehl, R. Kulkarni, K.-P. Fritz, T. Guenther, T. Groezinger, and A. Zimmermann, “ Reliability Investigation and Lifetime Estimation of LEDs Based on Thermal Transient Testing and Simulation” MDPI Electronics, (in plan).

M. Soltani, R. Kulkarni, Y. Liu, M. Barth, T. Groezinger, and A. Zimmermann, “Experimental and computational study of array effects on LED thermal management on molded interconnect devices MID,” presented at the 13th International Congress Molded Interconnect Devices (MID), Wuerzburg, 2018, p. 6.

M. Soltani, R. Kulkarni, T. Groezinger, and A. Zimmermann: Simulative und experimentelle Untersuchungen zu Zuverlässigkeit von  kunststoffbasierten Mikrosystemen, Moldflow Simulationsforum, Pforzheim, Juni 2017

M. Soltani: Wie aus Daten Informationen werden; Effiziente Auswertung und statistische Versuchsplanung mit Minitab, Kolloquium der MST, Stuttgart, Juni 2017


R. Kulkarni, M. Soltani, P. Wappler, T. Guenther, K.-P. Fritz, T. Groezinger, A. Zimmermann: Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding.  J. Manuf. Mater. Process. 2020,  4, 26.

T. Guenther, L. Diegel, M. Roeder, M. Drexler, M. Haybat, P. Wappler, M. Soltani, A. Zimmermann: Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding.  Appl. Sci. 2020,  10, 4197.

H. Müller, T. Meissner, T. Grözinger, T. Vieten, M. Soltani, W. Eberhardt, A. Zimmermann: Rapid Prototyping von Molded Interconnect Devices MID, 10. Innovationsforum Smarte Technologien & Systeme, Donaueschingen, Germany, 15.03.2018

H. Müller, T. Meissner, T. Grözinger, T. Vieten, M. Soltani, W. Eberhardt, A. Zimmermann: Rapid Prototyping von MID durch Additive Fertigung und Laserlöten, Workshop "Visions to Products – MID and Beyond", Stuttgart, 10.10.2017

R. Kulkarni, P. Wappler, M. Soltani, M. Haybat, T. Günther, T. Grözinger, A. Zimmermann: An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages, MDPI JMMP, 2019

R. Kulkarni, D. Hera, M. Soltani, T. Günther, T. Grözinger, A. Zimmermann: Feasibility of manufacturing packaged electronic systems by thermoset injection molding, Cork, Ireland, SSI 2017

M. Barth, R. Kulkarni, M. Soltani, W. Eberhardt, A. Zimmermann: Heat Dissipation for MID Applications in Lighting Technology, 3D-MID Kongress, Nürnberg, 2016

Since 2015: Supervision of the lecture "Packaging and Interconnection Technology for Microsystems - Technologies" (each SS, 4 SWS), Institute for Micro Integration IFM, University of Stuttgart, GER.

Since 2015: Conducting the exercises for the lecture "Packaging and Interconnection Technology for Microsystems - Technologies" (each SS, 2 SWS), Institute for Micro Integration IFM, University of Stuttgart, GER.

Since 2015: Supervision of APMB and specialization practical courses "Finite Element Simulation on Micromechanical Structures" (every SS, 2 SWS)

2015 to 2018: Support for the lecture "Modeling and Simulation in Microsystems Technology" (every SS, 2 SWS), Institute for Micro Integration IFM, University of Stuttgart, GER.

2015 to 2017: Science Day, University of Stuttgart, GER.

05.2010 to 04.2011: Execution and supervision of the MATLAB course      
Execution and supervision of the exercises "System Dynamic Fundamentals of Control Engineering", Institute for Systems Theory and Control Engineering IST, University of Stuttgart, GER.

F. Zehl: Investigations on the reliability of LEDs mounted on heatsinks made of thermally conductive plastics, SA, University of Stuttgart, 2018

T.C. Andreadis, C. Singarajah, O. Cherif, S. Ben Mabrouk, A. Baron Imada: Simulative and experimental investigation of plastic-based heatsinks, PA, University of Stuttgart, 2018

M. Paulus, L. Schröder, H. Reck, K. Zhao: Development and construction of a 3D technology demonstrator, PA, University of Stuttgart, 2017

T. Scheinost: Thermal analysis of heatsinks made of thermally conductive plastics, SA, University of Stuttgart, 2017

M. Freyburger: Design and validation of a measurement system for estimating the lifetime of LEDs on molded interconnect devices, SA, University of Stuttgart, 2017

F. Lenhardt: Studies on reliability and lifetime models of LEDs on molded interconnect devices, SA, University of Stuttgart, 2016

Y. Liu: Characterization and FEM simulation of thermal properties of engineering and high-performance plastics, SA, University of Stuttgart, 2016


M. Singer: Concept study for a miniaturized quantum sensor-based voltage measurement system, MA, University of Stuttgart, 2020 (with Dr. T. Günther)

R. Bach: ZTH Test Bench for Power Electronics, SA, University of Stuttgart, 2020 (with K. Werum)

R. Lutz: Material Data Acquisition of Silver Sinter Compounds on Spatial Circuit Carriers, SA, University of Stuttgart, 2019 (with K. Werum)

P. Li: Investigations on inkjet-printed heating structures, MA, University of Stuttgart, 2019 (with D. Juric)

S. Krafft: Lifetime prognosis of thermoset injection molded encapsulated electronics under thermal cycling using coupled simulation models, SA, University of Stuttgart, 2018 (with R. Kulkarni)

J. El Chemaly: Studies on the reliability of thermoset injection molded encapsulated electronics under thermal cycling, SA, University of Stuttgart, 2018 (with R. Kulkarni)

Microsystems technology, Packaging and interconnection technology, Reliability, Electronics, Thermal management, Modelling & Simulation, Statistical design of experiments, Spatial and injection molded circuit carriers              

Artificial intelligence, machine learning, data analysis

Configurable LED-lighting with modular design based on 3D-MID
https://www.hahn-schickard.de/en/projects/projects/iledmid

Transponder antennas for identification of surgical instruments
https://www.hahn-schickard.de/en/projects/projects/trantmed

Investigations on the cost-effective packaging of electronic and microsystem components by means of thermoset injection moulding
https://www.hahn-schickard.de/en/projects/projects/kapselung

Cost-effective and application-oriented manufacturing of 3D ceramic substrates
https://www.hahn-schickard.de/en/projects/projects/lasker3d

Integration of millimeter wave radio systems using the LDSMID-Technology

Weight-, volume-reduced and space-saving power electronics based on innovative substrate materials with additive 3D metallization and manufacturing techniques

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