Institut für Mikrointegration

Veröffentlichungen

Hier finden Sie alle Publikationen des IFM.

Publikationen am IFM

  1. Kulkarni, R., Wappler, P., Soltani, M., Haybat, M., Guenther, T., Grözinger, T., & Zimmermann, A. (2019). An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages. Journal of Manufacturing and Materials Processing, 3, 18. https://doi.org/10.3390/jmmp3010018
  2. Röder, M., Schilling, P., Hera, D., Günther, T., & Zimmermann, A. (2018). Influences on the Fabrication of Diffractive Optical Elements by Injection Compression Molding. Journal of Manufacturing and Materials Processing, 2(1), 5. https://doi.org/10.3390/jmmp2010005
  3. Soltani, M., Freyburger, M., Kulkarni, R., Mohr, R., Grözinger, T., & Zimmermann, A. (2018). Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices. Instruments, 2. https://doi.org/10.3390/instruments2040028
  4. Kulkarni, R. A., Hera, D., Soltani, M., Günther, T., Grözinger, T., & Zimmermann, A. (2017). Feasibility of manufacturing packaged electronic systems by thermoset injection molding. Smart Systems Integration. Presented at the Cork, Ireland.
  5. Hera, D., Günther, T., & Zimmermann, A. (2017). Duroplaste – Hightech für die mikroelektronischen Packages von morgen. Presented at the 25. Stuttgarter Kunststoffkolloquium, Stuttgart.
  6. Müller, H., Weser, S., Liu, Y., Vieten, T., Günther, T., Eberhardt, W., & Zimmermann, A. (2017). Additive Fertigung von Spritzgusswerkzeugeinsätzen für MID.
  7. Röder, M., Hera, D., Thiele, S., Pruss, C., günther, T., Osten, W., & Zimmermann, A. (2016). 3D laser direct-writing based master fabrication for injection compression molding of diffractive-refractive elements. Presented at the European Optical Society Annual Meeting, Berlin.
  8. Müller, H., Weser, S., Liu, Y., vieten, T., Günther, T., Eberhardt, W., & Zimmermann, A. (2016). Generative Processes for Rapid Prototyping of MID: Methods and Potentials. Proceedings of 12th International Congress Molded Interconnect Devices. Presented at the Würzburg.
  9. Müller, H., Weser, S., Liu, Y., Günther, T., Eberhardt, W., & Zimmermann, A. (2015). Rapid-Prototyping von MID mittels generativer Verfahren.
  10. Hera, D., Günther, T., Berndt, A., Harendt, C., Schulze Spüntrup, J. D., Reuter, C., … Zimmermann, A. (2015). Flexible packaging by film assisted molding for micro assembly technologies based on PCB. International Conference and Exhibition on Integration Issues of Miniaturized Smart Systems. Presented at the Copenhagen.
  11. Hera, D., Schulze Spüntrup, J. D., Günther, T., Harendt, C., Berndt, A., Reuter, C., … Zimmermann, A. (2015). Flexible packaging by film assisted molding for microintegration of MEMS based sensors. Presented at the European Microelectronics and Packaging Conference & Exhibition, Fridrichshafen, Germany.
  12. Beichter, S., Weser, S., Müller, H., Petillon, S., Haug, B., Günther, T., … Zimmermann, A. (2015). Functionalized Sensor Packaging Based on Thermoset Injection Molding and Selective Metallization Technology. Presented at the 20th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, Germany.
  13. Guenther, Thomas, Kong, C. (Charlie), Lu, H., Svehla, M., Lovell, N., Ruys, A., & Suaning, G. J. (2014). Pt-Al2O3 interfaces in cofired ceramics for use in miniaturized neuroprosthetic implants. Journal of Biomedical Materials Research Part B Applied Biomaterials, 102(3), 500–507. https://doi.org/10.1002/jbm.b.33027
  14. Matic, V., Liedtke, L., Guenther, T., Buelau, A., Ilchmann, A., Keck, J., … Kueck, H. (2014). Inkjet printed differential mode touch and humidity sensors on injection molded polymer packages. SENSORS, 2014 IEEE, 2234–2237. https://doi.org/10.1109/ICSENS.2014.6985485
  15. Polzinger, B., Matic, V., Liedtke, L., Keck, J., Hera, D., Günther, T., … Kück, H. (2014). Printing of Functional Structures on Molded 3D Devices. 11th International Congress Molded Interconnect Devices – Scientific Proceedings, 1038, 37--42. https://doi.org/10.4028/www.scientific.net/AMR.1038.37
  16. Green, R. A., Guenther, T., Jeschke, C., Jaillon, A., Yu, J. F., Dueck, W. F., … Suaning, G. J. (2013). Integrated electrode and high density feedthrough system for chip-scale implantable devices. Biomaterials, 34(26), 6109--6118. https://doi.org/10.1016/j.biomaterials.2013.04.054
  17. Patel, S., Guenther, T., Dodds, C. W. D., Kolke, S., Privat, K. L., Matteucci, P. B., & Suaning, G. J. (2013). Materials design considerations involved in the fabrication of implantable bionics by metallization of ceramic substrates. 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 759–762. https://doi.org/10.1109/EMBC.2013.6609611
  18. Guenther, Thomas, Lovell, N., & Suaning, G. J. (2012). Bionic vision: System architectures - A review. Expert Review of Medical Devices, 9(1), 33–48.
  19. Guenther, T., Mintri, A., Lim, W. W., Jung, L. H., Lehmann, T., Lovell, N. H., & Suaning, G. J. (2011). Laser-micromachined, chip-scaled ceramic carriers for implantable neurostimulators. 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 1085–1088. https://doi.org/10.1109/IEMBS.2011.6090253
  20. Dodds, C. W. D., Schuettler, M., Guenther, T., Lovell, N. H., & Suaning, G. J. (2011). Advancements in electrode design and laser techniques for fabricating micro-electrode arrays as part of a retinal prosthesis. 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 636–639. https://doi.org/10.1109/IEMBS.2011.6090141
  21. Guenther, T., Dodds, C. W. D., Lovell, N. H., & Suaning, G. J. (2011). Chip-scale hermetic feedthroughs for implantable bionics. 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 6717–6720. https://doi.org/10.1109/IEMBS.2011.6091656
  22. Günther, T., Schüttler, M., Ordonez, J. S., Henle, C., Wilde, J., & Stieglitz, T. (2009). A Novel Interconnection Technology for Laser-Structured Platinum Silicone Electrode Arrays. 4th European Conference of the International Federation for Medical and Biological Engineering. https://doi.org/10.1007/978-3-540-89208-3_574
  23. Schuettler, M., Henle, C., Ordonez, J. S., Meier, W., Guenther, T., & Stieglitz, T. (2008). Interconnection technologies for laser-patterned electrode arrays. 2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 3212–3215. https://doi.org/10.1109/IEMBS.2008.4649887
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