R. Saleh, S. Schütt, M. Barth, T. Lang, W. Eberhardt, und A. Zimmermann, „Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization“,
Micromachines, Bd. 13, Nr. 8, Art. Nr. 8, 2022, doi:
10.3390/mi13081240.
Zusammenfassung
The assembly of passive components on flexible electronics is essential for the functionalization of circuits. For this purpose, adhesive bonding technology by isotropic conductive adhesive (ICA) is increasingly used in addition to soldering processes. Nevertheless, a comparative study, especially for bending characterization, is not available. In this paper, soldering and conductive adhesive bonding of 0603 and 0402 components on flexible polyimide substrates is compared using the design of experiments methods (DoE), considering failure for shear strength and bending behavior. Various solder pastes and conductive adhesives are used. Process variation also includes curing and soldering profiles, respectively, amount of adhesive, and final surface metallization. Samples created with conductive adhesive H20E, a large amount of adhesive, and a faster curing profile could achieve the highest shear strength. In the bending characterization using adhesive bonding, samples on immersion silver surface finish withstood more cycles to failure than samples on bare copper surface. In comparison, the samples soldered to bare copper surface finish withstood more cycles to failure than the soldered samples on immersion silver surface finish.BibTeX
R. Saleh, M. Barth, W. Eberhardt, und A. Zimmermann, „Bending Setups for Reliability Investigation of Flexible Electronics“,
Micromachines, Bd. 12, Nr. 1, Art. Nr. 1, 2021, doi:
10.3390/mi12010078.
Zusammenfassung
Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.BibTeX
R. Saleh, F. Mohn, M. Barth, W. Eberhardt, und A. Zimmermann, „Digital Process Chain for Processing of Bend-Sensitive Functional Structures on a Flexible Substrate“,
IEEE Transactions on Components, Packaging and Manufacturing Technology, Bd. 11, Nr. 9, Art. Nr. 9, 2021, doi:
10.1109/TCPMT.2021.3101910.
Zusammenfassung
System-in-foil technology continues to realize relevance in industry and research. In this article, a digital process chain for the fabrication of bend-sensitive sensor structures on a flexible polyimide foil is described. This means that none of the steps in this process chain requires the manufacturing of a structured mask or cliché. Therefore, an arbitrary layout can be manufactured and easily be changed without major effort. Patterning of the sensor layout is realized by direct imaging of a laminated dry film photoresist. The sensor structure is fabricated by a liftoff process using sputtering of a NiCr layer. Finally, the sensor structures are characterized by a static bending test.BibTeX
E. Hirt
u. a., „3D-MID Evaluation and Validation for Space Applications“, in
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). 2019, S. 868–877. doi:
10.1109/ECTC.2019.00136.
Zusammenfassung
The potential of 3D-MID technologies for Space applications is investigated within the ESA Artes 5.1 programme. Several test samples and test vehicles have been built to demonstrate assembly techniques, weight gain and have been characterised to achieve TRL 5. In this paper possible assembly processes for 3D-MID are shown and the results of environmental testing are presented.BibTeX
