The Institute for Micro Integration (IFM) works in the field of microsystems technology. Research focus is on the electronic assembly, interconnection and packaging technology of microsystems. Furthermore new sensors and actuators are being developed.
Current Research Projects
3D distance sensor for industry 4.0
Optical device for rotary encoder mounted on printed circuit board
Demonstrator for digital process chain (additive manufacturing, laser structuring, assembly)
Ultrathin and mechanically flexible chip on foil substrate
Three dimensional interconnect device (based on thermoplastic material)