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Institut für Mikrointegration (englischer Teilbaum)
Institute
Team
Tritschler, Patrick

Patrick Tritschler

Wissenschaftliche Hilfskraft / Doktorand
Institut für Mikrointegration

Contact

Allmandring 9b
70569 Stuttgart

Publications

P. Tritschler, T. Ohms, P. Degenfeld-Schonburg, F. Zschocke, and A. Zimmermann, “Detection schemes for two-mode squeezed fiber optic Sagnac interferometry,” IEEE Sensors Letters, Nov. 2023, doi: 10.1109/LSENS.2023.3333751.
- Abstract
- BibTeX
Abstract
Fiber optic Sagnac interferometer can measure the rotation rate of a system with a high sensitivity. However, they require a large sensor area which leads to a huge footprint and size compared to their MEMS counterpart. Consequently, the performance decreases when using chip integrated Sagnac interferometers with small sensor areas. Here, we address this issue and present a method to improve the sensitivity at a small scale. Therefore, we utilize twomode squeezed light that can be generated in a ring resonator via four-wave mixing (FWM), which can have a very low noise. We show that the combination of classical coherent light and squeezed light can improve the sensor performance compared to a classical fiber optic Sagnac interferometer. For this purpose, we discuss two different configurations that are suited for various applications. The first one makes use of the low-noise of squeezed light and is suited for small and low loss systems using intensitiy difference (ID) measurements while the second one measures the variance of squeezed light via product detection (PD) and is suited for larger and lossy systems.
BibTeX
@article{10320213, abstract = {Fiber optic Sagnac interferometer can measure the rotation rate of a system with a high sensitivity. However, they require a large sensor area which leads to a huge footprint and size compared to their MEMS counterpart. Consequently, the performance decreases when using chip integrated Sagnac interferometers with small sensor areas. Here, we address this issue and present a method to improve the sensitivity at a small scale. Therefore, we utilize twomode squeezed light that can be generated in a ring resonator via four-wave mixing (FWM), which can have a very low noise. We show that the combination of classical coherent light and squeezed light can improve the sensor performance compared to a classical fiber optic Sagnac interferometer. For this purpose, we discuss two different configurations that are suited for various applications. The first one makes use of the low-noise of squeezed light and is suited for small and low loss systems using intensitiy difference (ID) measurements while the second one measures the variance of squeezed light via product detection (PD) and is suited for larger and lossy systems.}, author = {Tritschler, Patrick and Ohms, Torsten and Degenfeld-Schonburg, Peter and Zschocke, Fabian and Zimmermann, André}, doi = {10.1109/LSENS.2023.3333751}, issn = {2475-1472}, journal = {IEEE Sensors Letters}, month = {11}, title = {Detection schemes for two-mode squeezed fiber optic Sagnac interferometry}, year = 2023 }
P. Tritschler, T. Hiller, T. Ohms, W. Mayer, and A. Zimmermann, “Sensor Individual Non-Orthogonality Correction in Low-Cost MEMS Gyroscopes Using Neural Networks,” in 2023 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), in 2023 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL). 2023, pp. 1–4. doi: 10.1109/INERTIAL56358.2023.10103806.
- Abstract
- BibTeX
Abstract
The research presented in this work compensates non-orthogonality over temperature stress effects in low-cost open-loop MEMS gyroscopes using neural networks (NN) for a sensor individual compensation to improve the sensor performance. The non-orthogonality is included in the sensor cross-axis sensitivity (CAS) of MEMS gyroscopes. Using the model-agnostic meta-learning algorithm (MAML) as a self-calibration algorithm and one initial measurement after soldering, an individual compensation model is generated for each sensor that predicts the non-orthogonality using the MEMS gyroscope's quadrature value as an input. It will be shown that a sensor-individual model outperforms a compensation model that should fit for all sensors at once like linear regression or classic NN and improves the non-orthogonality by 82.7 %, 7.5 % and 70 % for yx-, zx-, and zy-non-orthogonality,
BibTeX
@inproceedings{10103806, abstract = {The research presented in this work compensates non-orthogonality over temperature stress effects in low-cost open-loop MEMS gyroscopes using neural networks (NN) for a sensor individual compensation to improve the sensor performance. The non-orthogonality is included in the sensor cross-axis sensitivity (CAS) of MEMS gyroscopes. Using the model-agnostic meta-learning algorithm (MAML) as a self-calibration algorithm and one initial measurement after soldering, an individual compensation model is generated for each sensor that predicts the non-orthogonality using the MEMS gyroscope's quadrature value as an input. It will be shown that a sensor-individual model outperforms a compensation model that should fit for all sensors at once like linear regression or classic NN and improves the non-orthogonality by 82.7 %, 7.5 % and 70 % for yx-, zx-, and zy-non-orthogonality,}, author = {Tritschler, Patrick and Hiller, Tobias and Ohms, Torsten and Mayer, Wolfram and Zimmermann, André}, booktitle = {2023 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)}, doi = {10.1109/INERTIAL56358.2023.10103806}, pages = {1-4}, title = {Sensor Individual Non-Orthogonality Correction in Low-Cost MEMS Gyroscopes Using Neural Networks}, year = 2023 }
W. Mayer, A. Küster, P. Tritschler, T. Hiller, D. Radović, and A. Zimmermann, “Modeling and Experimental Analysis of Low-Cost MEMS Gyroscopes Under PCB Bending Stress,” in 2023 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), in 2023 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL). 2023, pp. 1–4. doi: 10.1109/INERTIAL56358.2023.10103800.
- Abstract
- BibTeX
Abstract
This work is concerned with the examination of one-dimensional stress effects in mode-split, open-loop MEMS gyroscopes with the goal to predict the sensitivity change under printed circuit board (PCB) bending stress. Measurements with ten triaxial gyroscopes are compared to simulation results based on a detailed analytical model. The dependencies of gap distance and overlap of the in- and out-of-plane detection capacitances related to bending stress are formulated. Sensitivity change is predicted with 75% accuracy and the sign of gradient is correct for all measurements. Besides the change in geometry parameters of capacitances the effects of mechanical bending stress on the entire system are discussed. The purpose of the paper is to show the fundamental relationships on which all further considerations regarding MEMS gyroscopes under PCB stress are built.
BibTeX
@inproceedings{10103800, abstract = {This work is concerned with the examination of one-dimensional stress effects in mode-split, open-loop MEMS gyroscopes with the goal to predict the sensitivity change under printed circuit board (PCB) bending stress. Measurements with ten triaxial gyroscopes are compared to simulation results based on a detailed analytical model. The dependencies of gap distance and overlap of the in- and out-of-plane detection capacitances related to bending stress are formulated. Sensitivity change is predicted with 75% accuracy and the sign of gradient is correct for all measurements. Besides the change in geometry parameters of capacitances the effects of mechanical bending stress on the entire system are discussed. The purpose of the paper is to show the fundamental relationships on which all further considerations regarding MEMS gyroscopes under PCB stress are built.}, author = {Mayer, Wolfram and Küster, Alexandra and Tritschler, Patrick and Hiller, Tobias and Radović, Dušan and Zimmermann, André}, booktitle = {2023 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)}, doi = {10.1109/INERTIAL56358.2023.10103800}, pages = {1-4}, title = {Modeling and Experimental Analysis of Low-Cost MEMS Gyroscopes Under PCB Bending Stress}, year = 2023 }