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Peter Mack

M.Sc.

Wissenschaftlicher Mitarbeiter / Doktorand
Institut für Mikrointegration

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Allmandring 9b
70569 Stuttgart
Deutschland

  1. M. Ruess et al., “GaN half-bridges on electrical and thermal co-designed ceramic substrates,” Power Electronic Devices and Components, vol. 11, p. 100091, 2025, doi: https://doi.org/10.1016/j.pedc.2025.100091.

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