Dieses Bild zeigt Thomas Günther

Thomas Günther

Herr Dr.

Stellvertretender Institutsleiter
Institut für Mikrointegration

Kontakt

+49 711 685 83713
 +4971168583705

Allmandring 9b
70569 Stuttgart
Deutschland

  1. Guenther, T., Werum, K., Müller, E., Wolf, M., & Zimmermann, A. (2022). Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications. Journal of Manufacturing and Materials Processing, 6(1), 9. https://doi.org/10.3390/jmmp6010009
  2. Wappler, P., Horter, T., Kulkarni, R., Guenther, T., Fritz, K.-P., & Zimmermann, A. (2022). Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics. The International Journal of Advanced Manufacturing Technology, 1–12. https://doi.org/10.1007/s00170-021-08394-4
  3. Ruehl, H., Haub, M., Sahakalkan, S., Guenther, T., & Zimmermann, A. (2021). Focused ion beam writing of submicron structures into coated mold inserts. Proceedings of the 21st International Conference of the European Society for Precision Engineering and Nanotechnology, 137–140.
  4. Roeder, M., Guenther, T., Zimmermann, A., Giessen, H., Hentschel, M., & Thiele, S. (2021). Verfahren zum Herstellen eines Formwerkzeugs und Formwerkzeug zum Herstellen eines optischen Elements. https://patentscope.wipo.int/search/de/detail.jsf?docId=WO2021001242
  5. Haub, M., Bogner, M., Guenther, T., Zimmermann, A., & Sandmaier, H. (2021). Development and Proof of Concept of a Miniaturized MEMS Quantum Tunneling Accelerometer Based on PtC Tips by Focused Ion Beam 3D Nano-Patterning. Sensors, 21(11), 3795. https://doi.org/10.3390/s21113795
  6. Schwenck, A., Grözinger, T., Guenther, T., Schumacher, A., Schuhmacher, D., Werum, K., & Zimmermann, A. (2021). Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. Sensors, 21(16), Article 16. https://doi.org/10.3390/s21165557
  7. Schilling, A., Ninz, P., Petillon, S., Weser, S., Knöller, A., Eberhardt, W., Guenther, T., Kern, F., & Zimmermann, A. (2021). Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien. MikroSystemTechnik Congress 2021.
  8. Guenther, T., Hausladen, F., Barth, M., Roeder, M., Janek, F., Drossart, D., Wurm, H., Sahakalkan, S., Stock, K., & Zimmermann, A. (2021). Development of a Micro-integrated hyperspectral imaging system. MikroSystemTechnik Congress 2021, 1–4.
  9. Haybat, M., Guenther, T., Kulkarni, R., Sahakalkan, S., Grözinger, T., Rothermel, T., Weser, S., & Zimmermann, A. (2021). Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds. Applied Mechanics, 2(4), 976–996. https://doi.org/10.3390/applmech2040057
  10. Schwenk, A., Guenther, T., & Zimmermann, A. (2021). Characterization and Benchmark of a Novel Capacitive and Fluidic Inclination Sensor. Sensors, 21(23), 8030. https://doi.org/10.3390/s21238030
  11. Haub, M., Günther, T., Bogner, M., & Zimmermann, A. (2021). Investigation of Focused Ion and Electron Beam Platinum Carbon Nano-Tips with Transmission Electron Microscopy for Quantum Tunneling Vacuum Gap Applications. Applied Sciences, 11(24), 11793. https://doi.org/10.3390/app112411793
  12. Ristok, S., Roeder, M., Thiele, S., Hentschel, M., Guenther, T., Zimmermann, A., Herkommer, A. M., & Giessen, H. (2020). Mass-producible micro-optical elements by injection compression molding and focused ion beam structured titanium molding tools. Optics Letters, 45(5), 1184--1187. https://doi.org/10.1364/OL.385599
  13. Guenther, T., Schwenck, A., Matteucci, P., Leigh, R., Svehla, M., Zimmermann, A., & Suaning, G. J. (2020). Practical Aspects and Limitations of Hermeticity Testing of Microencapsulations Using Cumulative Helium Leak Detection for Miniaturized Implantable Medical Devices. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(3), 351–359. https://doi.org/10.1109/TCPMT.2020.2968126
  14. Kulkarni, R., Soltani, M., Wappler, P., Guenther, T., Fritz, K.-P., Groezinger, T., & Zimmermann, A. (2020). Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding. Journal of Manufacturing and Materials Processing, 4(1), Article 1. https://doi.org/10.3390/jmmp4010026
  15. Guenther, T., Diegel, L., Roeder, M., Drexler, M., Haybat, M., Wappler, P., Soltani, M., & Zimmermann, A. (2020). Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding. Applied Sciences, 10(12), Article 12. https://doi.org/10.3390/app10124197
  16. Civelek, F., Kulkarni, R., Fritz, K.-P., Meyer, T., Troulos, C., Guenther, T., & Zimmermann, A. (2020). Open-Eco-Innovation for SMEs with Pan-European Key Enabling Technology Centres. Clean Technologies, 2(4), 422--439. https://doi.org/10.3390/cleantechnol2040026
  17. Roeder, M., Schilling, P., Fritz, K.-P., Guenther, T., & Zimmermann, A. (2019). Challenges in the Fabrication of Microstructured Polymer Optics. Journal of Micro and Nano-Manufacturing, 7(2), Article 2. https://doi.org/10.1115/1.4044219
  18. Röder, M., Günther, T., & Zimmermann, A. (2019). Review on Fabrication Technologies for Optical Mold Inserts. Micromachines, 10(4), 233. https://doi.org/10.3390/mi10040233
  19. Roeder, M., Thiele, S., Hera, D., Pruss, C., Guenther, T., Osten, W., & Zimmermann, A. (2019). Fabrication of curved diffractive optical elements by means of laser direct writing, electroplating, and injection compression molding. Journal of Manufacturing Processes, 47, 402–409. https://doi.org/10.1016/j.jmapro.2019.10.012
  20. Kulkarni, R., Wappler, P., Soltani, M., Haybat, M., Guenther, T., Grözinger, T., & Zimmermann, A. (2019). An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages. Journal of Manufacturing and Materials Processing, 3, 18. https://doi.org/10.3390/jmmp3010018
  21. Röder, M., Schilling, P., Hera, D., Günther, T., & Zimmermann, A. (2018). Influences on the Fabrication of Diffractive Optical Elements by Injection Compression Molding. Journal of Manufacturing and Materials Processing, 2(1), 5. https://doi.org/10.3390/jmmp2010005
  22. Röder, M., Meißner, T., Günther, T., & Zimmermann, A. (2018). Micro-lens array fabrication by means of ultra-precision milling and injection compression molding. Polymer Replication on Nanoscale, Technical University of Denmark, Copenhagen.
  23. Röder, M., Drexler, M., Guenther, T., & Zimmermann, A. (2018). Evaluation of ultra-precision milling strategies for micro lens array mould inserts for the replication by injection-compression moulding. EUSPEN 18th International Conference & Exhibition, Venice.
  24. Röder, M., Drexler, M., Rothermel, T., Meißner, T., Günther, T., & Zimmermann, A. (2018). Injection Compression Molded Microlens Arrays for Hyperspectral Imaging. Micromachines, 9(7), 355. https://doi.org/10.3390/mi9070355
  25. Röder, M., Schilling, P., Fritz, K.-P., Günther, T., & Zimmermann, A. (2018). Challenges in the fabrication of microstructured polymer optics. World Congress on Micro and Nano Manufacturing, Portozoz.
  26. Wolf, M., Janek, F., Meißner, T., Wigger, B., Barth, M., Günther, T., Eberhardt, W., Geneiß, V., Lübke, T., Hedayat, C., Otto, T. W., & Zimmermann, A. (2018). Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing. International Congress Molded Interconnect Devices, Würzburg.
  27. Wolf, M., Janek, F., Meißner, T., Wigger, B., Barth, M., Günther, T., Eberhardt, W., Geneiß, V., Lueke, T., Hedayat, C., & Otto, T. W. (2018). Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology.
  28. Müller, H., Weser, S., Liu, Y., Vieten, T., Günther, T., Eberhardt, W., & Zimmermann, A. (2017). Additive Fertigung von Spritzgusswerkzeugeinsätzen für MID.
  29. Kulkarni, R. A., Hera, D., Soltani, M., Günther, T., Grözinger, T., & Zimmermann, A. (2017). Feasibility of manufacturing packaged electronic systems by thermoset injection molding. Smart Systems Integration.
  30. Hera, D., Günther, T., & Zimmermann, A. (2017). Duroplaste – Hightech für die mikroelektronischen Packages von morgen. 25. Stuttgarter Kunststoffkolloquium, Stuttgart.
  31. Zimmermann, A., Grözinger, T., Röder, M., Günther, T., Seybold, J., Bülau, A., Fritz, K.-P., Müller, H., & Eberhardt, W. (2017). Micro Manufacturing of Microfluidic, Optical and Mechatronic Devices. World Congress on Micro and Nano Manufacturing, Kaohsiung, Taiwan.
  32. Röder, M., hera, D., Schilling, P., Thiele, S., Pruss, C., Osten, W., Zimmermann, A., & Günther, T. (2017). 3D laser direct-writing based mold fabrication for the manufacturing of diffractive-refractive elements. Polymer Replication on Nanoscale, Aachen.
  33. Hera, D., Berndt, A., Guenther, T., Schmiel, S., Harendt, C., & Zimmermann, A. (2017). Flexible Packaging by Film-Assisted Molding for Microintegration of    Inertia Sensors. SENSORS, 17(7), Article 7. https://doi.org/10.3390/s17071511
  34. Röder, M., Hera, D., Thiele, S., Pruss, C., günther, T., Osten, W., & Zimmermann, A. (2016). 3D laser direct-writing based master fabrication for injection compression molding of diffractive-refractive elements. European Optical Society Annual Meeting, Berlin.
  35. Müller, H., Weser, S., Liu, Y., vieten, T., Günther, T., Eberhardt, W., & Zimmermann, A. (2016). Generative Processes for Rapid Prototyping of MID: Methods and Potentials. Proceedings of 12th International Congress Molded Interconnect Devices.
  36. Müller, H., Weser, S., Liu, Y., Günther, T., Eberhardt, W., & Zimmermann, A. (2015). Rapid-Prototyping von MID mittels generativer Verfahren.
  37. Beichter, S., Weser, S., Müller, H., Petillon, S., Haug, B., Günther, T., Eberhardt, W., & Zimmermann, A. (2015). Functionalized Sensor Packaging Based on Thermoset Injection Molding and Selective Metallization Technology. 20th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, Germany.
  38. Hera, D., Schulze Spüntrup, J. D., Günther, T., Harendt, C., Berndt, A., Reuter, C., Fritz, K.-P., Kück, H., & Zimmermann, A. (2015). Flexible packaging by film assisted molding for microintegration of MEMS based sensors. European Microelectronics and Packaging Conference & Exhibition, Fridrichshafen, Germany.
  39. Hera, D., Günther, T., Berndt, A., Harendt, C., Schulze Spüntrup, J. D., Reuter, C., Fritz, K.-P., Kück, H., & Zimmermann, A. (2015). Flexible packaging by film assisted molding for micro assembly technologies based on PCB. International Conference and Exhibition on Integration Issues of Miniaturized Smart Systems.
  40. Matic, V., Liedtke, L., Guenther, T., Buelau, A., Ilchmann, A., Keck, J., Polzinger, B., Eberhardt, W., & Kueck, H. (2014). Inkjet printed differential mode touch and humidity sensors on injection molded polymer packages. SENSORS, 2014 IEEE, 2234–2237. https://doi.org/10.1109/ICSENS.2014.6985485
  41. Polzinger, B., Matic, V., Liedtke, L., Keck, J., Hera, D., Günther, T., Eberhardt, W., & Kück, H. (2014). Printing of Functional Structures on Molded 3D Devices. 11th International Congress Molded Interconnect Devices – Scientific Proceedings, 1038, 37--42. https://doi.org/10.4028/www.scientific.net/AMR.1038.37
  42. Guenther, T., Kong, C. (Charlie), Lu, H., Svehla, M., Lovell, N., Ruys, A., & Suaning, G. J. (2014). Pt-Al2O3 interfaces in cofired ceramics for use in miniaturized neuroprosthetic implants. Journal of Biomedical Materials Research Part B Applied Biomaterials, 102(3), 500–507. https://doi.org/10.1002/jbm.b.33027
  43. Green, R. A., Guenther, T., Jeschke, C., Jaillon, A., Yu, J. F., Dueck, W. F., Lim, W. W., Henderson, W. C., Vanhoestenberghe, A., Lovell, N. H., & Suaning, G. J. (2013). Integrated electrode and high density feedthrough system for chip-scale implantable devices. Biomaterials, 34(26), 6109--6118. https://doi.org/10.1016/j.biomaterials.2013.04.054
  44. Patel, S., Guenther, T., Dodds, C. W. D., Kolke, S., Privat, K. L., Matteucci, P. B., & Suaning, G. J. (2013). Materials design considerations involved in the fabrication of implantable bionics by metallization of ceramic substrates. 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 759–762. https://doi.org/10.1109/EMBC.2013.6609611
  45. Guenther, T., Lovell, N., & Suaning, G. J. (2012). Bionic vision: System architectures - A review. Expert Review of Medical Devices, 9(1), 33–48.
  46. Guenther, T., Dodds, C. W. D., Lovell, N. H., & Suaning, G. J. (2011). Chip-scale hermetic feedthroughs for implantable bionics. 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 6717–6720. https://doi.org/10.1109/IEMBS.2011.6091656
  47. Guenther, T., Mintri, A., Lim, W. W., Jung, L. H., Lehmann, T., Lovell, N. H., & Suaning, G. J. (2011). Laser-micromachined, chip-scaled ceramic carriers for implantable neurostimulators. 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 1085–1088. https://doi.org/10.1109/IEMBS.2011.6090253
  48. Dodds, C. W. D., Schuettler, M., Guenther, T., Lovell, N. H., & Suaning, G. J. (2011). Advancements in electrode design and laser techniques for fabricating micro-electrode arrays as part of a retinal prosthesis. 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 636–639. https://doi.org/10.1109/IEMBS.2011.6090141
  49. Günther, T., Schüttler, M., Ordonez, J. S., Henle, C., Wilde, J., & Stieglitz, T. (2009). A Novel Interconnection Technology for Laser-Structured Platinum Silicone Electrode Arrays. 4th European Conference of the International Federation for Medical and Biological Engineering. https://doi.org/10.1007/978-3-540-89208-3_574
  50. Schuettler, M., Henle, C., Ordonez, J. S., Meier, W., Guenther, T., & Stieglitz, T. (2008). Interconnection technologies for laser-patterned electrode arrays. 2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 3212–3215. https://doi.org/10.1109/IEMBS.2008.4649887
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