Mateus Bagetti Jeronimo


Institut für Mikrointegration


Allmandring 9b
70569 Stuttgart

  1. M. Bagetti Jeronimo, J. Schindele, H. Straub, P. J. Gromala, B. Wunderle, und A. Zimmermann, „On the influence of lid materials for flip-chip ball grid array package applications“, Microelectronics Reliability, Bd. 140, S. 114869, 2023, doi:
  2. M. Bagetti Jeronimo, H. Straub, M. Hager, und A. Zimmermann, „Material Property Variability of Composites in Thermo-Mechanical Studies Involving Virtual Design of Experiments“, IEEE Transactions on Components, Packaging and Manufacturing Technology, Bd. 12, Nr. 5, Art. Nr. 5, Mai 2022, doi: 10.1109/TCPMT.2022.3163460.
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